New products that are expected to be launched in 2008 for superhard materials are likely to include:
1. The new type of cutting saw blade has an orderly distribution of diamond saw blades, which can increase the service life by 50% to 100%.
2. The dicing blade semiconductor processing tool precision-machined by ultra-thin cutting blades may make great progress.
3. High-speed grinding wheel for high-speed grinding wheel industry, the line speed is increased to more than 120 m/s.
4. CVD diamond film and nano-diamond powder will gradually be put into use in new products.
These are high-end products that will be favored by the market and are expected to replace imported products.
1. The new type of cutting saw blade has an orderly distribution of diamond saw blades, which can increase the service life by 50% to 100%.
2. The dicing blade semiconductor processing tool precision-machined by ultra-thin cutting blades may make great progress.
3. High-speed grinding wheel for high-speed grinding wheel industry, the line speed is increased to more than 120 m/s.
4. CVD diamond film and nano-diamond powder will gradually be put into use in new products.
These are high-end products that will be favored by the market and are expected to replace imported products.
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